Alphane Moon@lemmy.worldM to

Hardware@lemmy.worldEnglish · 1 day ago

LG Innotek to slim down smartphones by replacing solder balls with copper posts

www.tomshardware.com

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18

LG Innotek to slim down smartphones by replacing solder balls with copper posts

www.tomshardware.com

Alphane Moon@lemmy.worldM to

Hardware@lemmy.worldEnglish · 1 day ago

3

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.

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SwizzleStick@lemmy.zip
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1 day ago
Let’s see how well they drop test…
- a_person@lemdro.id
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  Or bend test lol (iphone 15)

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