Brief explanation:

This next evolution of EMIB enhances critical package power delivery efficiency metrics and speeds die-to-die communication. EMIB-T can be used to more effectively power compute and memory components — whereas standard EMIB connections struggled with high voltage droop due to a cantilevered power delivery path, EMIB-T utilizes TSVs to provide power delivery from the bottom of the chip package via TSV bridge dies, thus enabling a direct, low-resistance path for power delivery that’s critical for HBM4/4e integration.

So I didn’t have to go to ARM chip for decent battery life?